Sometimes it just comes down to the basics! Here’s the Spanner list of commonly used hardware acronyms: A-H
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AVL |
|
Approved Vendor List |
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B2B |
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Business to Business |
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B2C |
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Business to Consumer |
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BOM |
|
Bill of Materials |
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CE |
|
Consumer Electronics (industry) |
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CE Mark |
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Certified designation signifying conformity with European requirements |
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CM |
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Contract Manufacturer |
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CMF |
|
Color, Material, Finish |
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CN |
|
China |
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CNY |
|
Chinese New Year |
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COGS |
|
Cost of Goods Sold |
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CY |
|
Calendar Year |
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D2C |
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Direct to Consumer |
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DBT |
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Design → Build → Test |
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DFA |
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Design for Assembly |
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DFM |
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Design for Manufacturing |
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DOE |
|
Design of Experiments |
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DRI |
|
Directly Responsible Individual |
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DSP |
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Digital Signal Processing |
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DUR |
|
Due Upon Receipt |
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DVT |
|
Design Validation Testing |
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EAU |
|
Estimated Annual Units |
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ECO |
|
Engineering Change Order |
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EE |
|
Electrical Engineer or Electrical Engineering |
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EMI |
|
Electromagnetic Interference |
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EMS |
|
Electronics Manufacturing Services |
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EOL |
|
End of Life |
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EOM |
|
End of Month |
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EOW |
|
End of Week |
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EOY |
|
End of Year |
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EVT |
|
Engineering Validation Testing |
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F2F |
|
Face to face |
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FA |
|
Failure Analysis |
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FAI |
|
First Article Inspection |
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FATP |
|
Final Assembly Test & Packout |
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FCS |
|
First Customer Shipment |
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FEA |
|
Finite Element Analysis |
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FEP |
|
Final Engineering Prototype |
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FF |
|
Fixed Fee |
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FMEA |
|
Failure Modes Effects & Analysis |
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FW |
|
Firmware |
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FY |
|
Fiscal Year |
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H1 or H2 |
|
First half of year or Second half of year |
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HK |
|
Hong Kong |
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HVM |
|
High Volume Manufacturing |
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HW |
|
Hardware |